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Printed Circuit Design & Fab Circuits Assembly – July 2024
This year’s exhibition at PCB East featured more than 65 companies across the printed circuit industry, and reports from the show floor show that the industry is healthy and growing.
AI: The Shiny New Tool in the Engineer’s Toolbox. AI use in the PCB design field is still developing, but capabilities are rising. By taking advantage of its ability to learn from both good and bad designs, AI can become a valuable tool for new designers to perform tasks traditionally achievable only by experts.
System-in-Package and Multichip Module Technology. The development of the system-on-chip (SoC) has led to smaller form factors in electronics, but those complex systems generate high costs and have other market constraints. The integration of separately manufactured components into a higher-level assembly – system-in-package (SiP) – can leverage the advanced capabilities of packaging technology but with better yield and lower overall cost.
AI: The Shiny New Tool in the Engineer’s Toolbox. AI use in the PCB design field is still developing, but capabilities are rising. By taking advantage of its ability to learn from both good and bad designs, AI can become a valuable tool for new designers to perform tasks traditionally achievable only by experts.
System-in-Package and Multichip Module Technology. The development of the system-on-chip (SoC) has led to smaller form factors in electronics, but those complex systems generate high costs and have other market constraints. The integration of separately manufactured components into a higher-level assembly – system-in-package (SiP) – can leverage the advanced capabilities of packaging technology but with better yield and lower overall cost.
Printed Circuit Design & FAB / Circuits Assembly offers cutting-edge and tutorial information on PCB design, fabrication and assembly in each issue. It's the world's only source for end-to-end electronics supply chain technical information!
English | True PDF | 97 Pages | 24.4 MB
Download : Printed Circuit Design & Fab Circuits Assembly – July 2024
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